Ingeniero electrónico

Electronic HW engineer in charge of the electronic design, power up and testing of subsystems from a metal-powder 3D printer. My tasks are listed below:

Electronic schematic design with OrCAD CADENCE.
Electronic power up of the 3D printer: PCA’s, sensors (CAN, I2C) and actuators.
Distributed electronic design based on CAN protocol.
Electronic circuit simulation with PSpice.
Data acquisition circuits design from Analog and Digital signal sources.
Support to PCB team to optimize the overall signal integrity and increase the feasibility to pass EMI/EMC tests.
Cabling definition and routing strategies.
Lead the integration of electronic subsystems with the rest of the printer.
Mutual support with FW team to proper systems initialization and issue solving.
High-level FW programming with Python and TCL/TK.
Setups design and development to initialize systems at low level: DC motor drivers, cooling systems, temperature & pressure sensors.
Lead the problem-solving strategies within production and post-production phase.
Generation of technical documentation and reporting with LaTeX & Office.

EE HW engineer leading the electronic design and implementation of a post processor PLC-based machine for the management of residual dust from a metal-powder 3D printer. My tasks are listed below:

Design of PLC-Based industrial cabinets.
Project management with Gantt
Electrical routing of sensors and actuators.
Cabling and connectors selection.
Selection of protection elements based on previous power consumption analysis.
Pneumatic systems design for powder transportation and cleaning.
Communication protocols such as PROFINET, PROFIBUS, IO-LINK.
Electrical design based on safety SIL/PL grade.
Accomplishment of regulations IP6X, NEMA & ATEX, UL/IEC.
Electrical power up & testing side by side with FW team.
Heat dissipation analysis to select proper cooling elements.

Electronic HW product engineer in charge of the design of electronic products within a wide range of sectors such as medical, industrial, consumer and automotive from concept to production phase. My tasks are listed below:

Market analysis to select the proper electronic components to fulfill customer’s requirements.
Electronic schematic design with ALTIUM Designer.
Design for manufacturing and BOM - cost oriented.
Electronic design based on MCU / MPU.
Application of communication protocols such as I2C, SPI, LVDS, UART, USB and CAN.
Heat dissipation analysis to proper component selection.
Electronic circuit simulation with PSpice. 
Support to PCB team to optimize the overall signal integrity and increase the feasibility to pass EMI/EMC tests.
Receive feedback from EMC/EMI test results and change the design accordingly.
Signal integrity analysis: Ringing, Jittering, Cross-Talking, FFT and eye pattern. 
Electronic instrumentation: Oscilloscope, PSU, DMM, Impedance analyzer, Wave Generator, Data loggers and Logic analyzers.
Issue tracking with Jira. 8D methodology for automotive projects.
Electronic HW testing.
Project Design Failure Mode & Effects Analysis (DFMEA).
C programming based on MCU for peripheral testing purposes.
C# libraries programming to control electronic measurement instrumentation to run automatic PCA tests.
Electronic product lifetime analysis: stress tests and thermal analysis.
Support to manufacturing team to bring the product to mass production.
Fixtures (FCT), CBA and EOLT design to automatic functional testing of PCA’s. Program automatic tests with TestStand and LabVIEW.
Product power up in customer’s facilities. Production supervision and failure analysis (MTBF, MTTF) based on Six Sigma methodology.
Display selection from several technologies such as OLED, LED and LCD for Automotive and Consumer projects.
Optical analysis to validate panel/display technical specifications: GAMUT analysis, time response, FoV, WB and BIN check.
Generation of technical documentation and reporting with LaTeX & Office.